hsmb-c190, hsmb-c170, hsmb-c110, hsmb-c150, hsmb-c191 device selection guide footprint (mm) sic blue parts per reel 2.00 x 1.25 hsmb-c170 4000 1.60 x 0.80 hsmb-c190/c191 4000 3.20 x 1.00 [1] hsmb-c110 3000 3.20 x 1.60 hsmb-c150 3000 note: 1. right-angle package. caution: hsmb-c1xx leds are class 1a esd sensitive per jesd22-a114c.01. please observe appropriate precautions during handling and processing. refer to avago technologies application note an-1142 for additional details. HSMB-CXXX surface mount chip leds data sheet features ? small size ? industry standard footprint ? compatible with ir solder ? difused optics ? operating temperature range of C30c to +85c ? right angle package available ? sic blue color ? available in 8 mm tape on 7" (178 mm) diameter reels applications ? keypad backlighting ? push-button backlighting ? lcd backlighting ? symbol backlighting ? front panel indicator description these blue chip leds are designed in an industry standard package for ease of handling and use. blue color chip led is a new product that ofers color diferentiation for backlighting applications. the hsmb-c150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. the hsmb- c170 has the widely used 2.0 x 1.25 mm footprint. the hsmb-c190 and hsmb-c191 have the industry standard 1.6 x 0.8 mm footprint, and their low profles (0.8 mm for hsmb-c190 and 0.6 mm for hsmb-c191) and wide view - ing angles make these leds exceptional for backlighting applications. the hsmb-c110 is a right-angle package with the univer - sally accepted dimensions of 3.2 x 1.0 x 1.5 mm. this part is ideal for lcd backlighting and sidelighting applications. all packages are compatible with ir refow solder pro - cesses. the small size and wide viewing angle make these leds prime choices for backlighting applications and front panel illumination especially where space is a premium.
2 package dimensions hsmb-c190 hsmb-c170 hsmb-c110 hsmb-c150 hsmb-c190 pkg dimen - b (c170) 2.0 (0.079 ) 0.3 (0.012) 0.4 0.15 (0.016 0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.4 0.15 (0.016 0.006) 1.4 (0.055) 0.62 (0.024) led die diffused epoxy pc board soldering terminal 1.25 (0.049) cathode line hsmb-c190 pkg dimen - a (c190) 1.6 (0.063 ) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 (0.012) polarity cathode mark 0.8 (0.031) 0.3 0.15 (0.012 0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min. hsmx-c190 pkg dimen - a (c150) 3.2 (0.126 ) 0.5 (0.020) 0.50 0.2 (0.020 0.008) 0.6 (0.024) polarity cathode mark 1.1 (0.043) 0.50 0.2 (0.020 0.008) 2.0 (0.079) 0.8 (0.031) led die diffused epoxy pc board soldering terminal 1.6 (0.063) cathode line 3.2 (0.126 ) 0.5 (0.020) 0.8 (0.031) polarity cathode line 1.5 (0.059) led die clear epoxy pc board soldering terminal 1.0 (0.039) 1.0 (0.039) 2.6 (0.102 ) 1.6 (0.063 ) cathode line hsmb-c110 3.2 (0.126 )
3 hsmb-c191 note: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. absolute maximum ratings at t a =25c parameter hsmb-c190/c170/c110/c150/c191 units dc forward current [1] 20 ma peak pulsing current [2] 100 ma power dissipation 92 mw reverse voltage (i r = 100 a) 5 v maximum led junction temperature 95 c operating temperature range -30 to +85 c storage temperature range -40 to +85 c soldering temperature see refow soldering profle (figure 7 & 8) n otes: 1. derate linearly as shown in figure 4 for temperature above 25c. 2. pulse condition of 1/10 duty and 0.1 msec. width. hsmx-c191 1.6 (0.063 ) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.3 (0.012) polarity cathode mark 0.6 (0.023) 0.3 0.15 (0.012 0.006) 1.0 (0.039) 0.4 (0.016) led die diffused epoxy pc board soldering terminal 0.8 (0.031) cathode line 0.7 (0.028) min.
4 light intensity (iv) bin limits [1] intensity (mcd) intensity (mcd) bin id min. max. bin id min. max. a 0.11 0.18 n 28.50 45.00 b 0.18 0.29 p 45.00 71.50 c 0.29 0.45 q 71.50 112.50 d 0.45 0.72 r 112.50 180.00 e 0.72 1.10 s 180.00 285.00 f 1.10 1.80 t 285.00 450.00 g 1.80 2.80 u 450.00 715.00 h 2.80 4.50 v 715.00 1125.00 j 4.50 7.20 w 1125.00 1800.00 k 7.20 11.20 x 1800.00 2850.00 l 11.20 18.00 y 2850.00 4500.00 m 18.00 28.50 optical characteristics at t a =25c luminous peak dominant viewing intensity [1] wavelength wavelength angle 2 1/2 part no. color i v (mcd) @ 20 ma peak (nm) d (nm) (degrees) [2] min. typ. typ. typ. typ. hsmb- sic blue 1.80 6.0 428 466 170 c190/c170/ c150/c191 hsmb-c110 sic blue 1.80 6.5 428 466 130 n otes: 1. the luminous intensity, i v , is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. u 1/2 is the of-axis angle where the luminous intensity is 1/2 the peak intensity. electrical characteristics at t a =25c reverse forward voltage breakdown thermal capacitance c v f (volts) v r (volts) resistance (pf) @ v f = 0 v, part no. @ i f = 20 ma @ i r = 100 a r j-p (c/w) f = 1 mhz typ. max. min. typ. typ. hsmb-c190/c170/c150/c191 3.8 4.6 5 300 67 hsmb-c110 3.8 4.6 5 300 67 note: 1. bin categories are established for classifcation of products. products may not be available in all categories. please contact your avago representative for information on currently avail - able bins. tolerance: 1 nm note: 1. bin categories are established for class- ifcation of products. products may not be available in all categories. please contact your avago representative for information on currently available bins. blue color bins [1] dom. wavelength (nm) bin id min. max. a 460.0 465.0 b 465.0 470.0 c 470.0 475.0 d 475.0 480.0 v f tolerance: 0.1 v tolerance: 15%
5 figure 1. relative intensity vs. wavelength. figure 3. relative luminous intensity vs. forward current. figure 4. maximum forward current vs. ambient temperature. figure 5. relative intensity vs. angle for hsmb-c110. figure 2. forward current vs. forward voltage. hsmb-c190 fig 2 100 10 1 0.1 3.0 3.2 3.6 3.8 4.0 v f ? forward voltage ? v i f ? forward current ? ma 3.4 0 5 15 25 i f ? forward current ? ma 0 0.4 1.0 1.2 relative luminous intensity (normalized at 20 ma ) hsmb-c190 fig 3 20 0.6 0.2 0.8 10 0 25 0 20 60 80 100 5 i f max. ? maximum forward current ? ma t a ? ambient temperature ? c 40 hsmb-c190 fig 4 15 10 20 380 100 0 580 680 20 relative intensity ? % wavelength ? nm 480 hsmb-c190 fig 1 60 40 80 hsmb-c190 fig 5a relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2 0 3 0 5 0 7 0 9 0 -90 -20 -80 -60 -40 -10 10 40 60 80 hsmb-c190 fig 5b relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2 0 3 0 5 0 7 0 9 0 -90 -20 -80 -60 -40 -10 10 40 60 80
6 figure 6. relative intensity vs. angle for hsmb-c170, hsmb-c190, hsmb-c150, and hsmb-c191. figure 9. recommended soldering pattern for hsmb-c170. figure 10. recommended soldering pattern for hsmb-c190 and c191. figure 11. recommended soldering pattern for hsmb-c110. figure 8. recommended pb-free refow soldering profle. note: 1. all dimensions in millimeters (inches). 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) 1.2 (0.047) hsmb-c190 fig 8 0.8 (0.031) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) hsmb-c190 fig 9 hsmb-c190 fig 6 relative intensity ? % 100 0 angle 80 60 50 70 20 10 30 40 90 -70 -50 -30 0 2 0 3 0 5 0 7 0 9 0 -90 -20 -80 -60 -40 -10 10 40 60 80 figure 7. recommended refow soldering profle. 217 c 200 c 60 - 120 sec. 6 c/sec. max. 3 c/sec. max. 3 c/sec. max. 150 c 255 - 260 c 100 sec. max. ( acc. to j-std-020c) 10 - 30 sec. time temperature 5.0 (0.200) 1.0 (0.039) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) 0.9 (0.035) 0.2 (0.008) hssm-c110 fig 8 0.9 (0.035) hsmb-c190 fig 7 230c max. 10 sec. max. 4c/sec. max. over 2 min. time temperature 4c/sec. max. 140-160c ?3c/sec. max.
7 figure 14. reel dimensions. note: 1. all dimensions in millimeters (inches). figure 13. reeling orientation. figure 12. recommended soldering pattern for hsmb-c150. 1.5 (0.059) 1.5 (0.059) 1.5 (0.059) 2.0 (0.079) hsmx-c190 fig 8 cathode side printed label user feed direction 10.50 1.0 (0.413 0.039) 59.60 1.00 (2.346 0.039) ? 20.20 min. (? 0.795 min.) 6 ps 178.40 1.00 (7.024 0.039) 3.0 0.5 (0.118 0.020) 4.0 0.5 (0.157 0.020) 5.0 0.5 (0.197 0.020) ? 13.1 0.5 (? 0.516 0.020) 8.0 1.0 (0.315 0.039)
8 figure 16. tape leader and trailer dimensions. notes: 1. all dimensions in millimeters (inches). 2. tolerance is 0.1 mm (0.004 in.) unless otherwise specifed. figure 15. tape dimensions. hsmb-c190 fig 14 en d start there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cover tape. mounted with component s there shall be a minimum of 160 mm (6.3 inch) of empty component pockets sealed with cove r tape . minimum of 230 mm (9.05 inch) may consis t of carrier and/or cover tape . 8.00 0.30 (0.315 0.012) user feed direction dim. a (see table 1) 3.50 0.05 (0.138 0.002) 1.75 (0.069) dim. c (see table 1) 0.20 0.05 (0.008 0.002) carrier tape cover tape dim. b (see table 1) 4.00 (0.157) 2.00 0.05 (0.079 0.002) 4.00 (0.157) 1.50 (0.059) table 1 dimensions in millimeters (inches) cathode dim. a 0.10 ( 0.004) dim. b 0.10 ( 0.004) part number dim. c 0.10 ( 0.004) hsmx-c170 series 2.30 (0.091) 1.45 (0.057) 0.95 (0.037) hsmx-c190 series 1.80 (0.071) 0.95 (0.037) 0.87 (0.034) hsmx-c110 series 3.40 (0.134) 1.70 (0.067) 1.20 (0.047) hsmx-c191 series 1.85 (0.073) 0.88 (0.035) 0.85 (0.033) hsmx-c150 series 3.50 (0.138) 1.88 (0.074) 1.27 (0.050) hsmx-c110 position in carrier tape dim. b (see table 1) dim. a (see table 1) r 1.0 0.05 (0.039 0.002)
for product information and a complete list of distributors, please go to our website: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies limited in the united states and other countries. data subject to change. copyright ? 2006 avago technologies limited. all rights reserved. obsoletes 5989-0417en av02-0613en - july 27, 2007 refow soldering: for more information on refow soldering, refer to application note an-1060, surface mounting smt led indicator components. storage condition: 5 to 30c @ 60%rh max. baking is required before mounting, if: 1. humidity indicator card is > 10% when read at 23 5c. 2. device expose to factory conditions <30c/60%rh more than 672 hours. recommended baking condition: 605c for 20 hours.
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